As generative AI sparks a global technological wave, high-intensity computing demands from large model training and multimodal interaction are constantly pushing the boundaries of hardware performance. As the core "data channel" of AI computing, the bandwidth and capacity of memory directly determine the efficiency and ceiling of AI operations. Against this backdrop, SK hynix's HBM3e 24GB high-bandwidth memory emerges. With its 24GB large capacity, 3.2Tbps ultra-high bandwidth, and advanced TSV packaging technology, it has become the perfect partner for top-tier GPUs like those in AI servers and the GB200, injecting core momentum into the high-speed development of the AI industry.

Today, as AI model parameters scale toward trillions, traditional memory struggles to meet the demand for high-speed transmission of massive data, making the "computing bottleneck" a key constraint on technological breakthroughs. SK hynix, with over a decade of deep expertise in the HBM field and as the world's only company to develop and supply the full HBM product series, has precisely targeted this industry pain point with the launch of the HBM3e 24GB. Its 24GB large capacity design allows AI models to accommodate more parameters and heterogeneous data, reducing data exchange latency and significantly improving training accuracy. The 3.2Tbps ultra-high bandwidth represents a leap forward in data transmission efficiency, akin to building a "super-high-speed data highway" for GPUs, fully unleashing computing potential, dramatically shortening AI model training cycles, and accelerating the pace of technological iteration.

Behind this extreme performance lies SK hynix's leading technological积淀. The product employs advanced TSV (Through-Silicon Via) packaging technology, creating thousands of micro-vias on DRAM chips for vertical interconnection. This reduces package size while极大 lowering signal transmission loss, ensuring stability under high bandwidth. Notably, its advanced MR-MUF process improves heat dissipation performance by 10% compared to the previous generation while optimizing power efficiency. This achieves a perfect balance between performance and energy consumption in high-intensity AI computing scenarios, providing a solid guarantee for the stable operation of AI servers.

Today, SK hynix's HBM3e 24GB has become the core matching memory for AI servers and high-end GPUs (such as the GB200). Amid surging AI demand, global HBM capacity is highly concentrated, with expansion cycles lasting 18-24 months. SK hynix,凭借 its first-mover technological advantage and large-scale mass-production capability, has become a core supplier for global AI giants. Industry predictions indicate SK hynix holds over 50% share in HBM supply for key AI computing platforms like Google TPU, a testament to its product strength and market recognition. From AI training clusters in large data centers to cutting-edge applications like autonomous driving and medical imaging, SK hynix's HBM3e 24GB is driving AI technology from the lab to large-scale deployment with its comprehensive performance advantages.

Facing the vigorous development of the AI industry, innovation in memory technology knows no bounds. SK hynix's HBM3e 24GB is not only the core enabler of the current AI computing upgrade but also demonstrates its leadership in the global AI memory field. In the future, with the ongoing advancement of前沿 technologies like customized HBM, SK hynix will continue to break performance boundaries through technological innovation, providing even more powerful memory动力 for the innovative development of the global AI industry, turning the infinite possibilities of the intelligent era into reality.